Lead Free Surface Finishes

lead free surface finishes

The surface finish forms a critical interface between the component and the PCB. The finish has two essential functions, to protect the exposed copper circuitry and to provide a solderable surface when assembling (soldering) the components to the printed circuit board.

lead free surface finishes chart

Item Description
Gold Finish May be Electrolytic Electroless, or Immersion
ENIG (Electroless Nickel Immersion Gold) 2-5 micro inches. Purpose: To prevent oxidation, extend shelf life, provide a wire bonding surface, and used to provide an electrically conductive surface on PCBs. Used for solderability when the flatness of the pad is critical.
Hard Gold Purpose: Used for Gold Fingers (minimum 30 micro inches), soldering (maximum 17 micro inches), to prevent oxidation and extend shelf life.
Soft Gold Purpose: Used for wire bonding (Ultrasonic minimum 2 micro inches/Thermasonic minimum 12 micro inches) and to prevent oxidation and extend shelf life.
Immersion Silver Use for solderability purposes (2-5 micro inches). Used for solderability when the flatness of the pad is critical.
Lead Free Solder Use for solderability purposes (2-5 micro inches). Used for solderability when the flatness of the pad is not critical.
OSP (Organic Solderability Preservatives) Used for solderability when the flatness of the pad is critical.
White Tin (Immersion Tin) sed for solderability when the flatness of the pad is critical.

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Contact Info

Precision Technologies, Inc.
2200 Gladstone Ct. Ste: H-I,
Glendale Heights, IL 60139
Toll Free: 888-228-9440
Tel: 847-439-5447
Fax: 847-439-5448


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