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Precision Technologies - Technology Roadmap
 Category  Attribute  Current 2013  Near Term 2013 --2014  Long Term 2014
 Fine Line/Space
 Inner Layers (Line/Space)  3/3 mil  2.5/2.5 mil  2/2 mil
 Outer Layers (Line/Space)  3/4 mil  3/3 mil  2.5/2.5 mil
 Buried Core Holes
 Mechanical (Drilled Hole/Land)  5.9/12 mil  4/10 mil  2.5/2.5 mil
 Laser Drill (Drilled Hole/Land)  N/A  4/13 mil  3.5/8 mil
 Special Processing
 Controlled Depth Drilling - Blind Vias  Yes  Yes  Yes
 Sequential Lamination - Buried Vias  Yes  Yes  Yes
 Via in Pad Technology - Silver Epoxy  Yes  Yes  Yes
 Via in Pad Technology - Non Conductive Epoxy  Yes  Yes  Yes
 Edge Plating  Yes  Yes  Yes
 Materials
 High TD - RoHS  Yes  Yes  Yes
 Halogen Free  Yes  Yes  Yes
 High Performance  Yes  Yes  Yes
 Polyimide - High Temp  5.9/12 mil +  4/10 mil  3.5/8 mil
 Teflon  /-5.0 mil  +/-4.5 mil  +/-4.0 mil
 High Speed RF Signals  15:1.0  18:1.0  20:1.0
 Through Via Holes
 Drilled Hole/Land  5.9/12 mil  4/10 mil  3.5/8 mil
 Registration to Internal Land  +/-5.0 mil  +/-4.5 mil  +/-4.0 mil
 Maximum Copper Plating Aspect Ratio  15:1.0  18:1.0  20:1.0
 Panel / Board
 Maximum Layer Count  50 layer  60 layer  60+ layer
 Maximum Thickness  0.42  0.62  0.09
 Maximum Process Panel Size  24" x 30"  24" x 30"  24" x 30"
 Impedance
 Single ended & Differential Pair Tolerance  +/- 5%  +/- 4%  +/- 3%
 Imbedded Passives
 Resistors  N/A  +/- 15%  +/- 10%
 Capacitance/Capacitors  2.0 mil Core  1.0 mil Core  Thin Film
 Surface Finish
 SMOBC  Yes  Yes  Yes
 HASL  Yes  Yes  Yes
 Lead Free HASL  Yes  Yes  Yes
 Electrolytic Hard Gold  Yes  Yes  Yes
 Electrolytic Soft Gold  Yes  Yes  Yes
 Palladium  Yes  Yes  Yes
 Nickel  Yes  Yes  Yes
 Carbon Ink  Yes  Yes  Yes
 Immersion Silver  Yes  Yes  Yes
 Immersion Tin  Yes  Yes  Yes
 Organic Surface Protection (Entek)  Yes  Yes  Yes
 Quality Standards
 ISO 9001/2000  Yes  Yes  Yes
 IPC 6012 Class 1,2,3  Yes  Yes  Yes
 TL 9000  Yes  Yes  Yes
 Mil-PRF-31032  No  No  Yes